Chiplet technology: The Future of Integrated Circuits

Envisioning a Chiplet Future

In 2015, Dr. Sehat Sutardja, founder of Marvell Technology, foresaw the limitations of monolithic chip architecture and introduced the concept of chiplet architecture. It involves creating small modular "chiplets" that can be combined to form a complete system-on-chip (SoC).

The Era of Chiplet Adoption

Eight years later, the importance of chiplets was emphasized by Dr. Lisa Su, CEO of AMD, at the 2023 ISSCC. She stressed the need for energy efficiency and the potential of chiplets to address this challenge by bringing computing components closer together.

What is Chiplet Technology?

Chiplet architecture disaggregates circuit functions into interoperable units, each optimized for specific tasks. These chiplets can be mixed and matched to create a complete SoC. The packaging, or arrangement of these chiplets, can involve flat placement or vertical stacking.

Advantages of Chiplet Architecture

• Increased Design Flexibility
• Cost-Effectiveness
• Enhanced Performance
• Scalability and Customization
• Reduced Power Consumption
• Futureproofing and Innovation

Silicon Box: Innovating Chiplet Packaging

Silicon Box, founded by Dr. Sehat Sutardja, Weili Dai, and Dr. Byung Joon Han, is a pioneer in chiplet packaging. Their innovations include industry-best interconnections and novel panel packaging, resulting in significantly increased production compared to traditional methods.

Why We Invested in Silicon Box

TDK Ventures invested in Silicon Box after extensive exploration into hardware technologies for Big Data processing. Chiplets emerged as a pivotal enabling technology, offering advancements in digital transformation and energy efficiency. Silicon Box's technological innovations, team expertise, and strong investment partnership met our investment criteria for King of the Hill chiplet solutions.

The Future of Chiplet Technology

Chiplets are transforming the semiconductor industry, enabling foundries, chip designers, and OSATs to collaborate on cutting-edge applications. As the global demand for energy-efficient and efficient computing solutions grows, chiplet technology will continue to be a key enabler of technological progress.

Reference: Sutardja, Sehat. "1.2 the future of IC design innovation." In 2015 IEEE International Solid-State Circuits Conference-(ISSCC) Digest of Technical Papers, pp. 1-6. IEEE, 2015.